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| Structural and Thermal Engineers |
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| Product engineering and design verification |
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| Figure 1 - Thermal analysis of D-TECA module |
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| Figure 2 - Thermal/flow analysis of PWB card |
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| Figure 3 - Thermal analysis of finned heatsink |
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| Figure 4 - Thermal analysis of PWB with heatsink |
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| Figure 5 - Thermal analysis of Wahoo structure |
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